Collaboration Set to Advance Aluminium Alloys for 3D Printing


Constellium, an aluminum specialist, and Morf3D, a subsidiary of Nikon, are collaborating to reinforce aluminum alloy utilized in additive manufacturing. They purpose to qualify Constellium’s Aheadd CP1 steel powder for the SLM500 AM machines by Nikon SLM Options. This powder, developed for increased throughput in large-format AM, guarantees optimized particle measurement distribution, price discount, and elevated printing productiveness.

Collaboration Set to Advance Aluminium Alloys for 3D PrintingCollaboration Set to Advance Aluminium Alloys for 3D Printing
Aheadd CP1 can be licensed to be used in Components 1 racing. (Picture Credit score: Constellium)

The main focus is on producing light-weight, high-performance elements like warmth exchangers, exploiting the powder’s distinctive properties. This collaboration responds to the rising demand for large-format AM, aiming to revolutionize the business by enhancing design flexibility and materials properties of aluminum alloys.

“Our partnership with Constellium holds immense significance in advancing the event and qualification of superior aluminum alloy for Additive Manufacturing, now notably within the context of the SLM 500 platform,” mentioned Dr. Behrang Poorganji, Chief Expertise Officer of Morf3D.

“Collectively, we’re pioneering the event and qualification of CP1 aluminum alloy to unlock new potential for light-weight, high-performance elements similar to warmth exchangers produced by AM improvements.”

The partnership is a strategic transfer to fulfill market calls for and drive developments in aluminum’s use in additive manufacturing. It’s anticipated to contribute to extra environment friendly and cost-effective manufacturing processes, leveraging the strengths of each firms.

Come and tell us your ideas on our Fb, X, and LinkedIn pages, and don’t overlook to enroll in our weekly additive manufacturing e-newsletter to get all the most recent tales delivered proper to your inbox.



Leave a Reply

Your email address will not be published. Required fields are marked *

Back To Top